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第九届固态和集成电路技术国际会议ICSICT2008,10月20-23,北京
 
 
作者 佚名 摘自 未知 发表 2008-01-05 22:08:08 人气 6043 背景色 杏仁黄 秋叶褐 胭脂红 芥末绿 天蓝 雪青 灰 银河白(默认色) 字号   

第九届固态和集成电路技术国际会议(ICSICT2008)将于2008102023日在北京召开。 ICSICT是在中国举办的涵盖固态器件、集成电路设计、MEMS技术等方面的规模最大、影响最大的国际会议。


会议将邀请中、美、日、韩、欧洲及亚太其他各国固态器件和集成电路方面的专家作大会报告和分会邀请报告。这次会议将是国内外相关领域的研究人员之间交流信息和了解国际、国内最新进展的一次很好的机会。会议将出版正式论文集,论文集将具有IEEE统一书号。会议还设立学生优秀论文奖。


The 2008 ICSICT conference is the ninth of its kind aiming to provide an international forum for the presentation and discussion of recent advances in solid-state and integrated circuit technology. The conference will be held during October 20-23, 2008 in Beijing, China.
All aspects of solid-state devices, circuits, processing technologies, materials and other related research are within the scope of the conference. The three days of contributed and invited presentations on the latest developments in diverse fields given in oral and poster sessions, panel discussions on leading edge technology issues, and other activities will provide extensive opportunities for technical information exchange as well as a stimulating environment for mutual communication among participants. There will be discussions devoted to opportunities for cooperation and joint ventures in the microelectronics business in China. Best Paper Award will be issued at the closing of the conference.
The Scope and Topics of the Conference (Papers are solicited in, but not limited to the following areas)
● Silicon/Germanium/III-V IC devices
● Advanced process technology
● Silicon integrated circuits manufacturing
● Advanced memory technologies
● Compound semiconductor devices and circuits
● Device and interconnect reliability
● Modeling and simulation
● Semiconductor materials and material characterization
● Quantum electronics and nano-electronics
● Photonic devices and technologies
● Sensors and MEMS
● ASICs and SOC design technologies
● Low power circuits
● Digital, analog and mixed-signal circuits
● RF and microwave circuits
● EDA and DFM technologies
● Testing and DFT technologies
● Organic semiconductor devices and technologies
● Packaging and assembly technologies
● Equipment technology
● Others
Paper Submission:
Prospective authors are requested to submit full-length papers in English of no more than four pages. The papers are to be submitted in final form and, if accepted, will be published as submitted. On-line electric submission is preferred. Detailed instructions for paper preparation and submission can be found at web-site of the conference.
Deadline for Submission: May 31, 2008
Web-site : http://www.ime.pku.edu.cn/icsict
Email Address: icsict2008@ime.pku.edu.cn
会议的详情请参见会议的网址:http://www.ime.pku.edu.cn/icsict

上一篇文章 The 2nd ICMAN, October 18-20.
下一篇文章 IEEE NEMS09, Jan 5-8, Shenzh.
   

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