2018-03-01,Microsystems & Nanoengineering Summit 2018(MINE2018) 时间:2018年7月8至11日(7月8日注册报到) 地点:中国科学院学术会堂(地址:北京市海淀区中关村北一条15号)
 
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[DTIP-TPC] Last Call for Papers - DTIP'2015
 
 
作者 佚名 摘自 未知 发表 2014-11-14 11:59:04 人气 3246 背景色 杏仁黄 秋叶褐 胭脂红 芥末绿 天蓝 雪青 灰 银河白(默认色) 字号   

Dear colleagues,

This is for your kind information that the Regular Paper Submission Deadline for the Symposium on Design, Test, Integration and Packaging of MEMS or MOEMS (DTIP'2015) has been extended to November 14th with a further extension of one week to finalize submissions. The new timeline is as follows:


  • Before November 14th, summary submission including paper title, authors and a few-line abstract.

  • Before November 21st, to upload the pdf file to be reviewed (minimum 600 words plus figures, recommended format is 1500 words plus figures). Final papers (up to six pages in IEEE format) will be also considered.

This is your last chance to contribute towards the 17th edition of DTIP to be held in Montpellier, France, from April 27th till April 30th. Presented papers (either oral or posters) will be largely accessible to the scientific community through the IEEE Xplore portal and authors will be invited to contribute in a special session of a journal. This year the program will include the traditional two-set conferences, two special sessions and plenary invited talks. The following sessions are now opened for submission:

  • Special Session on “On-chip Instruments”, organized by Dr. Philippe Basset (ESIEE)

  • Special Session on "Co-design for MEMS based Smart Systems", organized by Dr. Gerold Schröpfer (Coventor)
  • Computer-Aided Design, Design and Test Conference: this Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS.
  • Microfabrication, Integration and Packaging Conference: this Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS.

More information on special sessions, conferences and submission procedure can be obtained on the symposium website (dtip-mems.org) or by email (dtip@dtip-mems.org).

We look forward to welcome you in Montpellier, France.

General Chair: Pascal NOUET, LIRMM, France

Local Chair: Frédérick MAILLY, LIRMM, France

Publication Chair: Benoit CHARLOT, IES, France

Computer-Aided Design, Design and Test Conference

Chair: Marta Rencz, BME, Hungary

Co-Chair: Francis Pressecq, CNES, France

Microfabrication, Integration and Packaging Conference

Chair: Yoshio Mita, University of Tokyo, Japan

Co-Chair: Peter Schneider, Fraunhofer IIS/EAS, Dresden, Germany


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