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DTIP2009(Design, Test, Integration and Packaging of MEMS/MOEMS 2009)
 
 
作者 佚名 摘自 未知 发表 2008-10-27 18:21:34 人气 3411 背景色 杏仁黄 秋叶褐 胭脂红 芥末绿 天蓝 雪青 灰 银河白(默认色) 字号   

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CALL FOR PAPERS
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Symposium on
Design, Test, Integration and Packaging of MEMS/MOEMS
Rome, Italy
1-3 April 2009

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Conference web site: http://cmp.imag.fr/conferences/dtip/dtip2009/
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Chair: Bernard COURTOIS, CMP, Grenoble, France
Co-Chair: Jean Michel KARAM, MEMSCAP, Bernin, France


Sponsored by:
http://cmp.imag.fr/
http://www.cpmt.org/


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CONFERENCES:


- CAD, DESIGN AND TEST
Chair: Tarik BOUROUINA, ESIEE, Noisy-le-Grand, France
Co-Chair: Aurelio SOMA, Politecnico di Torino, Italy


- MICROFABRICATION, INTEGRATION AND PACKAGING
Chair: Reza GHODSSI, U. of Maryland, College Park, USA
Co-Chair: Hsiharng YANG, National Chung Hsing U., Taiwan


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INVITATION TO PARTICIPATE
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This Symposium will be a follow-up to the very successful issues held
in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La
Napoule, in 2004 and 2005 in Montreux, Switzerland and in 2006, in 2007
in Stresa, Italy, in 2008 in Nice, France. This series of Symposia is
a unique single-meeting event expressly planned to bring together
participants interested in manufacturing microstructures and
participants interested in design tools to facilitate the conception
of these microstructures. Again, a special emphasis will be put on
the very crucial needs of MEMS/MOEMS in terms of packaging solutions.
The goal of the Symposium is to provide a forum for in-depth
investigations and interdisciplinary discussions involving design,
modeling, testing, micromachining, microfabrication, integration and
packaging of structures, devices, and systems.
We look forward to welcoming you to Rome and encourage you
to participate by submitting an abstract for one of the two Conferences.


Bernard COURTOIS & Jean-Michel KARAM
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SUBMISSION OF ABSTRACTS
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Dates:
Submission of abstracts: : 30 October 2008
Notification of acceptance: 08 January 2009
Submission will be electronically only at:
http://cmp.imag.fr/Conferences/dtip/dtip2009.
Your abstract must include preferably 1500 words.
Detailed instructions are posted on the Symposium web site.
Questions may be directed in the meantime by e-mail (dtip@imag.fr).


CONDITIONS OF ACCEPTANCE: Authors are expected to secure registration
fees and travel and accommodation funding, through their sponsoring
organizations, before submitting abstracts. Abstracts should contain
enough detail to clearly convey the approach and the results of the
research. Government and company clearance to present and publish
should be final at the time of submittal.
Commercial papers with no research, presenting products, cannot be
submitted to the Symposium. Such papers can be presented in the
framework of the exhibition (see corresponding section).
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INVITED TALKS
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to include:
-->Jeremie Bouchaud, iSuppli, Munich, Germany
MEMS and MOEMS market industry and market


The market for MEMS is growing from $6.5 billion in 2008 to almost
$9 billion in 2009. While the overall market is growing steadily, some
segments are maturing such as inkjet and DLPs while some others are
skyrocketing such as sensors for consumer electronics. After describing
the market and industry, this presentation will focus more particularly
on trends in MOEMS including digital micro-mirrors, optical MEMS for
telecom as well as emerging display technologies such as scanned beam
displays and reflective mirrors.


-->Christian A. Zorman, Case Western Reserve University, Cleveland,
Ohio, USA
Silicon Carbide as a material for biomedical microsystems


Silicon Carbide (SiC) is emerging as an enabling material for biomedical
microsystems due to its unique combination of electrical, mechanical and
chemical properties. This talk will review the latest advancements in
this area including on-going research to develop SiC thin films for
bio-microdevice packaging, bio-filtering, biomedical imaging and other
related applications.



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SPECIAL SESSIONS
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Special session on 3D Integration of MEMS
The Special session on 3D Integration of MEMS puts together papers on
demands for 3D-Integration, design support from application point of
view, 3D Integration technologies enabling stacking of MEMS as well as
application examples from different areas.
This special session is organized by Peter Schneider, Fraunhofer IIS/EAS
Dresden, Germany


Special Session on Electronics for MEMS
This session will put together papers addressing specific electronic
architectures for MEMS such as biasing, signal conditioning and read-out
circuits, electrostatic drivers and level-shifters, energy storage and
management... Contributions may address interface circuits and systems
but also the modeling of those and their simulation at different
abstraction levels or in different physical domains.
This special session is organized by Pascal Nouet, LIRMM, Montpellier,
France


and a Special Session on BioMEMS is expected.
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VENUE
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The Symposium will take place in the Jolly Hotel, in Rome, Italy.
In a magnificent location, overlloking the park of Villa Borghese and
only a few steps from the famous?ia Veneto?and Spanish steps. It can
be easily reached by air, rail and car.
Rome can be accessed by air, rail and by car: Air: International Airport
Airport (45/60 min. from Jolly Hotel by car).
There is a train service between the international airport (Fiumicino)
and the main railway (Stagione Termini) every 60-min. (one hour).
Rail: The main railway station is only 10 minutes away by taxi.
Road: From the North leaving the A1 motorway at Settebagni, from
the South by the A2 motorway along the Via Nomentana.


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CAD, Design and Test Conference
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Chair: Tarik BOUROUINA, ESIEE, Noisy-le-Grand, France
Co-Chair: Aurelio SOMA, Politecnico di Torino, Italy


CAD, Design and Test Conference Programme Committee: To include
Marc DESMULLIEZ, Heriot-Watt Univ., Edinburgh, UK
Yung C. LIANG, National Univ. of Singapore
Raafat MANSOUR, U. of Waterloo, Canada
Robert RUDD, Lawrence Livermore National Lab. Livermore, USA
Waleed FARIS, Int'l Islamic Univ. Malaysia, Malaysia
Kazuhiro HANE, Sendai University, Japan
Rainer LAUR, Univ. of Bremen, Germany
Francis PRESSECQ, CNES, Toulouse, France
Mahnaz SHAMSHIRSAZ, Amirkabir Univ. of Tech., Tehran, Iran
Hisham HADDARA, Si-Ware Systems, Cairo, Egypt
Andrew RICHARDSON, Lancaster University, UK
Patric SALOMON, 4M2C PATRIC SALOMON, Berlin, Germany
Ash PARAMESWARAN, SFU, Canada
Zheng CUI, RAL, Didcot, UK
Tamal MUKHERJEE, Carnegie Mellon Univ., Pittsburgh, USA
Pascal NOUET, LIRMM, France
Shawn BLANTON, Carnegie Mellon Univ., Pittsburgh, USA
Marta RENCZ, BUTE, Budapest, Hungary
Souhil MEGHERBI, Univ. Paris Sud, France
Marc A. POLOSKY, Sandia National Laboratories, Albuquerque, USA
Jian ZHU, Nanjing Electronic Devices Institute, China
Krish CHAKRABARTY, Duke Univ., Durham, USA
Igo BALK, The Ramzay Technologies Inc, Brighton, USA
Peter SCHWARZ, IIS Schaltungen, Dresden, Germany
Timo VEIJOLA, Helsinki Univ. of Technology, Finland
Gerhard WACHUTKA, Munich Univ. of Technology, Germany
Eric DONZIER, Shlumberger, France
Bart ROMANOWICZ, Nano Science & Technology Institute, Cambridge, USA
Benedetto VIGNA, STMicroelectronics, Cornadero, Italy
Thomas ZAHNER, OSRAM Opto Semiconductors, Germany



The CAD, Design and Test Conference will bring together researchers,
engineers and practitioners involved in the development of CAD tools
and design methodologies for MEMS and MOEMS. The participants will also
have the opportunity to interact with the other Conference by the means
of plenary talks.
The topics for this Conference include (preliminary):
- Technology CAD in general
- Modeling and simulation of fabrication processes
- Devices and components (sensors, actuators, ?
- MEMS/MOEMS libraries and IP
- Signal processing
- Integrated CAD tools
- Numerical simulation
- Yield estimation
- Failure mechanisms
- Fault modeling
- Fault simulation and test pattern generation
- Mechanical simulation
- Thermal evaluation
- Interoperability of CAD/CAE tools
- Multiphysics simulation
- Structured design methodologies
- Languages for interchange data among designs and tools
- Model order reduction
- MEMS and MOEMS in harsh environments

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Microfabrication, Integration and Packaging Conference
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Chair: Reza GHODSSI, U. of Maryland, College Park, USA
Co-Chair: Hsiharng YANG, National Chung Hsing U., Taiwan


Microfabrication, Integration and Packaging Conference
Programme Committee: To include
Xuechuan SHAN, SIMTech, Singapore
Chris van HOOF, IMEC, Leuven, Belgium
Skandar BASROUR, TIMA Lab., Grenoble, France
Ryutaro MAEDA, MEMS and Packaging Research Group, AIST, Tsukuba, Japan
David ALLEN, Cranfield Univ., Bedford, UK
Zhenfeng WANG, Singapore Institute of Manufacturing Technology (SIMTech), Singapore
Chantal Khan MALEK, Lab. FEMTO-ST/LPMO, Besan?n, France
Eng Hock TAY, National Univ. of Singapore
Juerg DUAL, ETH Zentrum, Z?ich, Switzerland
Gou-Jen WANG from National ChungHsing Univ. in Taiwan
Masayoshi ESASHI, Tohoku Univ., Japan
Henri CAMON, LAAS, Toulouse, France
Yves-Alain PETER, EPM, Montr?l, Canada
Bob PUERS, KU Leuven, Belgium
Wolfgang REINERT, Fraunhofer Institute for Silicon Technology, Itzehoe, Germany
Philippe RENAUD, EPFL, Lausanne, Switzerland
Bernd MICHEL, IZM, Berlin, Germany
Victor M. BRIGHT, Univ. of Colorado at Boulder, USA
Yuelin WANG, SIMIT, Shanghai, China
Kazuo SATO, Nagoya Univ., Japan
Andrew TAY, National Univ. of Singapore
Adrian IONESCU, EPFL, Lausanne, Switzerland
Alain BOSSEBOEUF, IEF, Paris-Orsay, France
Matthias WORGULL, FZK, Karlsruhe, Germany



The Microfabrication, Integration and Packaging Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.
The topics for this Conference include (preliminary):
- Integrated processes (micromachining, micromolding, ?
- Process integration between MEMS and electronics
- Microlithography issues unique to MEMS/MOEMS
- Manufacturing
- Materials
- Assembly technologies
- Packaging for harsh environments
- MOEMS packaging
- RF and microwave packaging
- Test structures
- Devices and components (sensors, actuators, ?
- Dimensional measurements
- Physical measurements
- Failure analysis
- Reliability
- Characterization
- Process monitoring
- Non destructive evaluation


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EXHIBITION
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An exhibition will be organized in the framework of the Symposium.
CAD software, products, equipments, instruments, foundries offerings,
etc. may be exhibited. Exhibitors who will register early enough will be
given the opportunity to give a product presentation during the vendor
session that will be placed in the Symposium programme. If you plan
to exhibit, please contact the Symposium Chair.
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SPECIFIC EVENTS SPONSORING
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If you wish to sponsor an event like a reception, a lunch, or any
specific event during the Symposium, please contact the Symposium Chair.
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ADVERTISING IN THE PROGRAMME BOOKLET
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The programme booklet will be widely distributed to announce the
Symposium. If you wish to advertise in the programme booklet, please
contact the Symposium Chair
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PROCEEDINGS
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The Proceedings of the Symposium will be available at the meeting.
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SPECIAL ISSUES OF JOURNALS AND MAGAZINES
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It is a tradition that Special Issues of Journals and Magazines are
published after the Symposium. These Special Issues collect revised
versions of papers presented during the Symposium. DTIP 2008 Special
Issues will be organized in the Journal of Microsystem Technologies and
in the Journal of Analog Integrated Circuits and Signal Processing.
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CONTACTS
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Bernard COURTOIS
CMP
Tel.: +33 4 76 57 46 15 - Fax: +33 4 76 47 38 14
Email: dtip@imag.fr


Jean-Michel KARAM
MEMSCAP
Tel.: +33 4 76 92 85 00 - Fax: +33 4 76 92 85 10
Email: Jean-Michel.Karam@memscap.com


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